The detail information of product

Pure Copper Heatsink Fabrication for Intel CPUs and Power Inverters

Pure copper heatsink fabrication is the premier thermal management solution for high-performance Intel CPUs and industrial inverter systems. At our precision engineering hub in Bac Ninh, Vietnam, VINACNC utilizes C1100 red copper with 99.9% purity to maximize superior thermal conductivity. The production workflow integrates comprehensive services from precision laser cutting and CNC bending to advanced welding, creating optimized Sk511 heatsink structures that ensure stable device operation and extend the lifespan of sensitive electronic components.

Specialized Copper Heatsink Machining Expertise at VINACNC

The manufacturing process at our facility ensures the strictest technical standards:

Precision CNC Cutting and Milling: Utilizing laser cutting or CNC milling to shape copper base plates and fin systems. Controlling surface roughness at the micron level enhances the actual contact area, eliminating thermal resistance between the CPU/Inverter surface and the heatsink.
CNC Bending Services: Shaping copper fins or heat pipes according to design profiles without fracturing the material structure. Precision bending optimizes installation space within inverter cabinets and computer chassis.
Advanced Welding Services: Applying specialized laser or TIG welding to bond cooling fins to the copper base. The welds ensure uniform thermal conductivity and extremely high mechanical strength, withstanding significant vibration and temperature fluctuations.
LED and Auxiliary Component Integration: Pre-designed grooves and mounting positions for indicator or decorative LEDs, providing a professional aesthetic for high-end PC systems and modern industrial equipment.

Professional Export Packaging and Preservation Process

Copper components are highly sensitive to oxidation and surface deformation. VINACNC implements a rigorous international standard packaging process for shipping from Vietnam:

Ultrasonic Cleaning: Thoroughly removes machining oils, fingerprints, and mechanical impurities using industrial ultrasonic systems before packaging.
Passivation and Anti-Oxidation: Copper surfaces undergo protective treatment, then components are wrapped in specialized VCI anti-rust paper or PE film to prevent salt-air humidity impacts.
Multi-layer Cushioning: Each heatsink is placed in shaped foam trays or thick bubble wrap to eliminate vibration and prevent mechanical impact from deforming fins or scratching precision contact surfaces.
International Standard Crating: Products are packed in fumigated wooden crates (ISPM 15 standard) or high-grammage reinforced cartons with secure strapping.
Traceability Labeling: Clear labeling displaying part codes, specifications, and barcodes for efficient destination logistics control.