The detail information of product

High-Precision Copper Pin Fin and Skiving Fin Heatsink Fabrication

Precision copper heatsink machining utilizing Pin Fin and Skiving Fin technologies is the ultimate thermal management solution for high-performance CPUs, server systems, and telecommunications equipment. At our precision engineering hubs in Bac Ninh, Vietnam, the use of pure red copper (C1100) combined with passivation techniques creates cooling systems that feature not only superior thermal conductivity but also durable oxidation resistance. VINACNC's workflow focuses on optimizing heat dissipation surface area within confined spaces, ensuring equipment operates stably under continuous thermal stress.

Technical Specifications of Copper Pin Fin and Skiving Fin Heatsinks

The differences in fin structures provide distinct advantages for specific applications:

Copper Skiving Fin Heatsink: This technology produces monolithic heatsinks where fins are "carved" directly from a solid copper block using specialized machinery. The greatest advantage is the monolithic structure, ensuring zero thermal resistance at the interface between the fins and the base, allowing for extremely dense and thin fins for instantaneous heat dissipation.
Copper Pin Fin Heatsink: Manufactured via cold forging or CNC machining to create copper pins. This structure allows for multi-directional airflow, which is highly effective in systems with restricted space or inconsistent airflow, maximizing surface heat exchange area.
Passivation Technology: Post-machining, the copper surface undergoes chemical treatment to form an ultra-thin oxide film. This film prevents copper tarnishing and corrosion from environmental factors without affecting thermal conductivity, preserving the aesthetics and long-term performance of the component.

Professional Export Packaging and Preservation Process

Copper heatsink components require absolute protection to maintain surface flatness and prevent oxidation during international transit from Vietnam. VINACNC implements a rigorous workflow:

Ultrasonic Cleaning: Thoroughly removes cutting oils and mechanical impurities from microscopic fin gaps using industrial ultrasonic systems.
Surface Anti-Oxidation: Following passivation, components are placed in specialized VCI (Vapor Corrosion Inhibitor) anti-rust paper or vacuum-sealed to prevent salt-air humidity impacts.
Multi-layer Cushioning: Each heatsink is placed in shaped foam trays or thick bubble wrap to eliminate mechanical vibration and impact that could deform the thin copper fins.
International Standard Crating: Products are packed in fumigated wooden crates (ISPM 15 standard) or high-grammage reinforced cartons with secure strapping.
Traceability Labeling: Clear labeling displaying part codes, specifications, and barcodes for efficient destination logistics control.