The detail information of product

High-Precision 1145mm Large-Scale Copper Skived Fin Heatsink Fabrication

Copper Skived Fin heatsink machining is the ultimate thermal management solution for high-power devices requiring instantaneous heat dissipation in confined spaces. With specialized dimensions of 210 x 1145 x 50 mm, this product represents our large-scale precision machining capabilities in Bac Ninh, Vietnam. Skiving technology allows for the creation of ultra-thin, high-density fins carved directly from a solid C1100 pure copper block, completely eliminating thermal resistance at the fin-to-base interface and ensuring superior heat transfer performance compared to conventional bonding or brazing methods.

Technical Advantages of Monolithic Copper Skiving

The manufacturing process at VINACNC focuses on maintaining material homogeneity to achieve peak cooling efficiency:

Monolithic Structure: Fins are carved directly from the solid copper blank. Since there is no thermal interface material or weld joint, heat from the source (CPU, IGBT, laser module) is conducted directly to the fins with zero interface resistance.
Ultra-High Fin Density: Skiving technology enables the fabrication of fins with thicknesses and pitches that conventional casting or milling cannot achieve. This significantly increases the heat exchange surface area within a fixed volume.
Flatness and Surface Roughness: The heatsink base is CNC machined to achieve micron-level flatness and ultra-fine surface roughness. This optimizes the actual contact area, eliminates air pockets, and enhances the heat transfer rate from the component to the heatsink.
Large-Format Machining Capability: Processing a copper block up to 1145 mm in length requires specialized machinery and strict thermal deformation control to ensure accuracy across the entire component length.

Professional Export Packaging and Preservation Process

Copper Skived Fin heatsink components require rigorous protection to maintain fin geometry and prevent surface oxidation. VINACNC implements an international standard packaging process:

Ultrasonic Cleaning: Thoroughly removes machining oils, residual chips, and impurities from extremely narrow fin gaps using industrial ultrasonic systems.
Surface Anti-Oxidation: Post-cleaning, products undergo passivation or are wrapped in specialized VCI anti-rust paper to prevent salt-air humidity impacts during transit from Vietnam.
Multi-layer Cushioning: Given the 1145 mm length, products are placed in rigid shaped foam trays or wrapped in multiple layers of thick bubble wrap to eliminate mechanical vibration and impact that could deform the thin copper fins.
International Standard Crating: Products are packed in fumigated wooden crates (ISPM 15 standard) reinforced with steel frames or secure strapping for absolute safety.
Traceability Labeling: Clear labeling displaying part codes, specifications, and barcodes for efficient destination logistics control.