1. Definition & Issues (The "Why")

In Laser Solder Ball Bumping technology for microcircuits, the nozzle is a critical component that guides the solder ball and withstands high-intensity laser energy. Buyers often face:

• Solder Clogging: Rough internal surfaces cause solder balls to jam or stick during the melting phase, disrupting the automated welding cycle.

• Thermal Instability: High laser energy heats the nozzle; if the material lacks superior thermal stability, the nozzle tip deforms, causing misalignment of the solder joints.

• Orifice Wear: High-speed movement of solder balls causes abrasive wear at the tip, leading to inconsistent ball sizes and weld quality.

Vina CNC eliminates these risks by utilizing ultra-fine Tungsten Carbide (Hard Alloy) with internal mirror-polishing to ensure smooth ball flow and exceptional heat resistance.

2. Technical Classification (The "How")

• Material: Micro-grain Tungsten Carbide with hardness rated at HRA 90-93.

• Internal Roughness: Achieves Ra 0.1 - 0.2, effectively preventing solder adhesion and friction.

• Orifice Size: Precision micro-machining from 0.1mm to 2.0mm, tailored for solder ball sizes (100µm to 1000µm).

• Concentricity: Strictly maintained within 0.005mm for perfect alignment.

3. Technical Advantages (The "Proof")

• Longevity: Service life 5-10 times longer than standard stainless steel or ceramic nozzles.

• Operational Efficiency: Stable high-speed output with minimal downtime for cleaning or maintenance.

• Quality Assurance: 100% inspection using electron microscopy and 3D CMM metrology.

4. Contact Information

• Company: Vina CNC Professional Services

• Hotline: +84 904609889

• Email: vinacnc.us@gmail.com

• Address: Bac Ninh, Vietnam.